5G Isolator
| Operating frequency (GHz) | Insertion Loss (dB) Max | Isolation (dB) Min | VSWR Max | Model series | Passing Power /Reflected Power (W) | Outline dimensions ΦD*H (mm) | Operating temperature (℃) | Connection method |
| 1.805~1.880 | 0.3 | 21 | 1.2 | BKHGS 2023-** | 20 | Ф9.5*6.35 | -40-110 | SMD |
| 1.880~1.920 | 0.3 | 21 | 1.2 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 1.930~1.990 | 0.3 | 21 | 1.2 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 2.110~2.170 | 0.3 | 23 | 1.15 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 2.300~2.400 | 0.25 | 23 | 1.15 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 2.496~2.690 | 0.25 | 23 | 1.15 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 2.620~2.690 | 0.23 | 23 | 1.15 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 3.400~3.600 | 0.2 | 23 | 1.15 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 3.300~3,600 | 0.23 | 23 | 1.15 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 3.400~3.800 | 0.23 | 23 | 1.15 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 3.600~3.800 | 0.2 | 23 | 1.15 | 20 | Φ9.5*6.35 | -40-110 | SMD | |
| 3.700~4.200 | 0.35 | 18 | 1.29 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 4.400~4.900 | 0.4 | 18 | 1.29 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| 4.800~5.000 | 0.25 | 23 | 1.15 | 20 | Ф9.5*6.35 | -40-110 | SMD | |
| Note: The above index data are typical values, and the test temperature is room temperature (25℃). | ||||||||
