Microstrip Assembly
| Operating frequency (GHz) | Bandwidth (MHz) | Insertion Loss (dB) Max | Isolation (dB) Min | VSWR Max | Model series | Passing Power /Reflected Power (W) | Outline dimensions L*W*H (mm) | Operating temperature (℃) | Connection method |
| ★5.0~13.0 | 4000 | 0.5/1 | 15/28 | 1.2 | BKHZW11 03-** | 20/10 | 11*10.5*3.5 | -55-85 | Gold wire bonding |
| FULL | 0.8/1.6 | 12/25 | 1.3 | 20/10 | 11*10.5*3.5 | -55-85 | Gold wire bonding | ||
| 8.0~12.0 | 2000 | 0.5/1 | 15/28 | 1.2 | BKHZW11 07-** | 20/2 | 9*10.4*4 | -55-85 | Gold wire bonding |
| FULL | 0.6/1.2 | 12/25 | 1.2 | 20/2 | 9*10.4*4 | -55-85 | Gold wire bonding | ||
| 14.0~18.0 | 2000 | 0.5/1 | 18/30 | 1.2 | BKHZW11 08-** | 10/1 | 8*7*3.5 | -55-85 | Gold wire bonding |
| FULL | 0.6/1.2 | 16/30 | 1.2 | 10/1 | 8*7*3.5 | -55-85 | Gold wire bonding | ||
| 14.0~18.0 | 2000 | 0.5/1 | 16/30 | 1.2 | BKHZW11 06-** | 10/1 | 7*8*3.5 | -55-85 | Gold wire bonding |
| FULL | 0.6/1.2 | 16/30 | 1.2 | 10/1 | 7*8*3.5 | -55-85 | Gold wire bonding | ||
| 25.0~27.0 | 1000 | 0.8/1.4 | 15/28 | 1.4 | BKHZW11 13-** | 5/1 | 4.5*6.5*3 | -55-85 | Gold wire bonding |
| FULL | 1/1.6 | 13/25 | 1.5 | 5/1 | 4.5*6.5*3 | -55-85 | Gold wire bonding | ||
| Note: The above index data are typical values, and the test temperature is room temperature (25℃). The products marked with "★" belong to the 2024 pre research project and are in the development stage. | |||||||||
