Products

Microstrip

Microstrip

Microstrip Isolator

Microstrip Isolator


          



Operating frequency
(GHz)
Bandwidth
(MHz)
Insertion Loss (dB)
Max
Isolation
(dB)
Min
VSWR
Max
Model seriesPassing Power
/Reflected Power
(W)
Outline dimensions L*W*H
(mm)
Operating temperature
(
)
Connection method
1.8~2.51000.4201.25BKHGW15
42-**
30/516*18/16*6.5-40-70Gold wire bonding
2000.5181.2530/516*18/16*6.5-40-70Gold wire bonding
2.0~3.51000.4201.2BKHGW14
23-**
20/514*16/14*5.5-40-70Gold wire bonding
2000.5201.220/514*16/14*5.5-40-70Gold wire bonding
2.7~3.53000.4201.2520/514*16/14*5.5-40-70Gold wire bonding
FULL0.5181.320/514*16/14*5.5-40-70Gold wire bonding
3.0~5.02000.4201.2BKHGW14
20-**
20/312*14/12*5-55-85Gold wire bonding
3000.5201.220/312*14/12*5-55-85Gold wire bonding
4.0~6.03000.4201.2520/312*14/12*5-55-85Gold wire bonding
5000.5181.320/312*14/12*5-55-85Gold wire bonding
4.0~7.05000.4201.2BKHGW14
22-**
10/29.5*12/9.5*4.5-55-85Gold wire bonding
10000.5201.210/29.5*12/9.5*4.5-55-85Gold wire bonding
8.0~12.010000.4201.2BKHGW15
21-**
10/29*10/9*4.5-55-85Gold wire bonding
FULL0.5201.310/29*10/9*4.5-55-85Gold wire bonding
4.5~9.05000.4201.2BKHGW14
24-**
10/28*8*4.5-55-85Gold wire bonding
10000.5181.310/28*8*4.5-55-85Gold wire bonding
5.0~6.0Full0.5161.4BKHGW14
25-**
20/206*7*3-55-85Gold wire bonding
7.0~18.020000.5201.25/16*7/6*3.5-55-85Gold wire bonding
40000.5181.35/16*7/6*3.5-55-85Gold wire bonding
15.0~36.010000.6201.3BKHGW15
43-**
5/15*6/5*3.5-55-85Gold wire bonding
20000.8181.45/15*6/5*3.5-55-85Gold wire bonding
40001.2141.55/15*6/5*3.5-55-85Gold wire bonding
26.0~40.05000.8181.3BKHGW15
44-**
5/14.5*5/4.5*3.5-55-85Gold wire bonding
10001161.45/14.5*5/4.5*3.5-55-85Gold wire bonding
20001.2161.45/14.5*5/4.5*3.5-55-85Gold wire bonding










Note: The above index data are typical values, and the test temperature is room temperature (25℃).


PRODUCTS PRODUCTS