Product Features
Out-of-Band Rejection & Return Loss VS Frequency (TA=25℃)
High-Precision Micro-Nanofabrication Process: Utilizes advanced micro- and nanofabrication techniques to achieve high-precision design and performance.
High Performance: Offers high performance with low temperature drift and high power handling capability.
Specialized Substrate: Features a special substrate and 50Ω coplanar waveguide output for superior signal integrity.
Gold Wire Bonding: Designed for gold wire bonding, making it ideal for multi-chip integrated module applications.
Environmental Parameters
Operating Temperature: -55°C to +85°C
Storage Temperature: -55°C to +125°C
Maximum Input Power: 35 dBm
Electrical Characteristics (TA=+25℃)
| Parameter | Minimum Value | Typical Value | Maximum Value | Unit |
|---|---|---|---|---|
| Center Frequency(f0) | - | 1.75 | - | GHz |
| Passband Frequency Range | 1.55 | - | 1.95 | GHz |
| Passband Ripple | - | - | 1 | dB |
| Center Insertion Loss | - | 2.5 | - | dB |
| Return Loss | - | 15 | - | dB |
| Out-of-Band Attenuation | ≥[email protected] | dB | ||
| ≥[email protected] | dB | |||
Outline Dimensions
| Dimension Symbol | Value(mm) | ||
| Minimum | Nominal | Maximum |
A | 6.9 | – | 7.0 |
B | 7.9 | – | 8.0 |
Typical Test Curves
