描述
Microstrip Components
Product Features
Planar Structure: Based on Printed Circuit Board (PCB) technology, featuring a flat and thin profile, making it easy to integrate into multi-layer circuit boards.
Small and Compact: Smaller in size and lighter in weight compared to waveguide or coaxial components, suitable for space-constrained applications.
Easy Integration: Can be directly soldered onto PCBs, compatible with Integrated Circuits (ICs) and other Surface Mount Technology (SMT) components, simplifying the assembly process.
Wide Frequency Range: Applicable to a broad spectrum from microwave to millimeter-wave, performing particularly well in high-frequency applications.
Cost-Effective: Leverages mature PCB manufacturing processes, suitable for large-volume production with relatively lower costs.
Versatility: Can be designed into various passive and active components such as filters, couplers, power dividers, antennas, oscillators, and more.
Good Repeatability: Standardized PCB manufacturing processes ensure consistent product performance.
Applications
Wireless Communication Systems: Widely used in cellular base stations (including 5G), Wi-Fi devices, Bluetooth modules, GPS receivers, etc., for building filters, power dividers, couplers, and antenna arrays.
Radar Systems: In miniaturized radar and phased array radar T/R (transmit/receive) modules, for signal processing and antenna integration.
Satellite Communications: Key components for RF front-ends and intermediate frequency processing in ground stations and on-board satellite equipment.
Aerospace and Defense: Applied in various airborne, satellite-borne, and military equipment, where strict requirements for size, weight, and reliability are paramount.
Internet of Things (IoT) Devices: Provides RF front-end solutions for miniaturized, low-power IoT modules such as smart home devices and wearables.
Test and Measurement Equipment: Serves as critical signal processing modules in RF/microwave test instruments.
Automotive Electronics: Used in in-car radar, V2X (Vehicle-to-Everything) communication modules, and other applications.
Product selection table
| Operating Frequency | Bandwidth | Insertion Loss | Isolation | VSWR | Model Series | Forward Power / Reverse Power | Outline Dimensions | Operating Temperature | Connector Type |
|---|---|---|---|---|---|---|---|---|---|
| GHz | MHz | (dB) MAX | dB MIN | MAX | Watts | L*W*H mm | ℃ | ||
| ★5.0-13.0 | 4000 | 0.5/1 | 15/28 | 1.2 | BKHZW1103-** | 20/10 | 11*10.5*3.5 | -55 +85 | Gold Wire Bonding |
| FULL | 0.8/1.6 | 12/25 | 1.3 | 20/10 | |||||
| 8.0~12.0 | 2000 | 0.5/1 | 15/28 | 1.2 | BKHZW1107** | 20/2 | 9*10.4*4 | ||
| FULL | 0.6/1.2 | 12/25 | 1.2 | 20/2 | |||||
| 14.0~18.0 | 2000 | 0.5/1 | 18/30 | 1.2 | BKHZW1108-** | 10/1 | 8*7*3.5 | ||
| FULL | 0.6/1.2 | 16/30 | 1.2 | 10/1 | |||||
| 14.0~18.0 | 2000 | 0.5/1 | 16/30 | 1.2 | BKHZW1106-** | 10/1 | 7*8*3.5 | ||
| FULL | 0.6/1.2 | 16/30 | 1.2 | 10/1 | |||||
| 25.0-27.0 | 1000 | 0.8/1.4 | 15/28 | 1.4 | BKHZW1113-** | 5/1 | 4.5*6.5*3 | ||
| FULL | 1/1.6 | 13/25 | 1.5 | BKHZW1113-** | 5/1 |
Note: The specifications above are typical values, and the test temperature is normal room temperature (25°C). Items marked with “★” are 2024 pre-research projects and are currently under development.
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